By John Lau, Cheng Lee, C. Premachandran, Yu Aibin
A finished advisor to 3D MEMS packaging equipment and recommendations Written via specialists within the box, complex MEMS Packaging serves as a necessary reference for these confronted with the demanding situations created via the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor provides state-of-the-art MEMS (microelectromechanical structures) packaging suggestions, akin to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you choose trustworthy, inventive, high-performance, strong, and low-cost packaging concepts for MEMS units. The e-book also will reduction in stimulating extra study and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, methods, production, checking out, and reliability. one of the issues explored: complicated IC and MEMS packaging tendencies MEMS units, advertisement functions, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding innovations Actuation mechanisms and built-in micromachining Bubble change, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging
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Extra info for Advanced MEMS Packaging (Electronic Engineering)
Albuquerque, NM), Conley, William R. (Tijeras, NM), “Pre-release plastic packaging of MEMS and IMEMS devices,” April 30, 2002. 2 Peterson, Kenneth A. (Albuquerque, NM), Conley, William R. (Tijeras, NM), “Protection of microelectronic devices during packaging,” January 1, 2002. Tilmans, Hendrikus A. C. (Maastricht, NL), Beyne, Eric (Leuven, BE), Van de Peer, Myriam (Brussel, BE), “Method of fabrication of a microstructure having an internal cavity,” October 2, 2001. Japanese MEMS Packaging Patents Some of the Japanese MEMS packaging patents selected from the Japan Patent Office (JPO) since 2001 are as follows: Patent No.
Sunnyvale, CA), Huibers, Andrew G. (Palo Alto, CA), Chiang, Steve S. (Saratoga, CA), “Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates,” November 11, 2008. Weigold, Jason W. (Somerville, MA), “Process of forming a microphone using support member,” November 11, 2008. Palmateer, Lauren (San Francisco, CA), Gally, Brian J. (Los Gatos, CA), Cummings, William J. (Millbrae, CA), Kothari, Manish (Cupertino, CA), Chui, Clarence (San Jose, CA), “Packaging for an interferometric modulator,” October 28, 2008.
2005. 2004. 2004. 2004. 2004. 2004. 2004. 2003. 2003. 2003. 2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05. 2. “Method for packaging an optical MEMS device,” Khonsari, Nassim (US), Chui, Clarence (US), EP2029473 (A2)—200903-04. 3. “Patterned contact sheet to protect critical surfaces in manufacturing processes,” Ya, Michael Wang Qing (US), Zhang, Junhong (US), CN101323428 (A)—2008-12-17.